Spartan-3e order of availability?

Can anyone in the know comment on what the likely order of
availability of Spartan-3e parts (in sub-1000 piece quantities,
not zillions) will be?  I'm hoping that the 3S500E in the
chipscale BGA will be one of the first; I've been waiting for
a high-density FPGA in a tiny package.  It's a shame that none
of the Spartan-3 parts larger than the 3S50 are available in
that package.

Thanks,
Eric

"Eric Smith" <eric@brouhaha.com> schrieb im Newsbeitrag
news:qhaclgn1s6.fsf@ruckus.brouhaha.com...
> Can anyone in the know comment on what the likely order of
> availability of Spartan-3e parts (in sub-1000 piece quantities,
> not zillions) will be?  I'm hoping that the 3S500E in the
> chipscale BGA will be one of the first; I've been waiting for
> a high-density FPGA in a tiny package.  It's a shame that none
> of the Spartan-3 parts larger than the 3S50 are available in
> that package.
>
> Thanks,
> Eric
>

Antti's forecast

1) NO S3E before September 2005
2) NO chipscale BGA before Q1 2006

lets hope I am wrong :)

Antti,

I got ours promised (but not 100% confirmed) for end of June (3S500E, 
CP132). Let's hope YOU are wrong... ;-)

Thomas
(sitting here sweating, maybe it's just the heat in Austria, maybe it's also 
the fear of not getting the parts in time...)

> Antti's forecast
>
> 1) NO S3E before September 2005
> 2) NO chipscale BGA before Q1 2006
>
> lets hope I am wrong :)

"Antti Lukats" <antti@openchip.org> schrieb im Newsbeitrag 
news:d9g8if$p07$02$1@news.t-online.com...
> "Eric Smith" <eric@brouhaha.com> schrieb im Newsbeitrag
> news:qhaclgn1s6.fsf@ruckus.brouhaha.com...
>> Can anyone in the know comment on what the likely order of
>> availability of Spartan-3e parts (in sub-1000 piece quantities,
>> not zillions) will be?  I'm hoping that the 3S500E in the
>> chipscale BGA will be one of the first; I've been waiting for
>> a high-density FPGA in a tiny package.  It's a shame that none
>> of the Spartan-3 parts larger than the 3S50 are available in
>> that package.
>>
>> Thanks,
>> Eric
>>
>
> Antti's forecast
>
> 1) NO S3E before September 2005
> 2) NO chipscale BGA before Q1 2006
>
> lets hope I am wrong :)
>
>
>
>
> 

Wau!

I like to be wrong on some occasions :)

Antti


"Thomas Entner" <aon.912710880@aon.at> schrieb im Newsbeitrag
news:42bbafca$0$13522$91cee783@newsreader01.highway.telekom.at...
> Antti,
>
> I got ours promised (but not 100% confirmed) for end of June (3S500E,
> CP132). Let's hope YOU are wrong... ;-)
>
> Thomas
> (sitting here sweating, maybe it's just the heat in Austria, maybe it's
also
> the fear of not getting the parts in time...)
>
> > Antti's forecast
> >
> > 1) NO S3E before September 2005
> > 2) NO chipscale BGA before Q1 2006
> >
> > lets hope I am wrong :)
>
> "Antti Lukats" <antti@openchip.org> schrieb im Newsbeitrag
> news:d9g8if$p07$02$1@news.t-online.com...
> > "Eric Smith" <eric@brouhaha.com> schrieb im Newsbeitrag
> > news:qhaclgn1s6.fsf@ruckus.brouhaha.com...
> >> Can anyone in the know comment on what the likely order of
> >> availability of Spartan-3e parts (in sub-1000 piece quantities,
> >> not zillions) will be?  I'm hoping that the 3S500E in the
> >> chipscale BGA will be one of the first; I've been waiting for
> >> a high-density FPGA in a tiny package.  It's a shame that none
> >> of the Spartan-3 parts larger than the 3S50 are available in
> >> that package.
> >>
> >> Thanks,
> >> Eric
> >>
> >
> > Antti's forecast
> >
> > 1) NO S3E before September 2005
> > 2) NO chipscale BGA before Q1 2006
> >
> > lets hope I am wrong :)
> >
> >
> >
> >
> >
>
>

"Eric Smith" <eric@brouhaha.com> wrote in message
news:qhaclgn1s6.fsf@ruckus.brouhaha.com...
> Can anyone in the know comment on what the likely order of
> availability of Spartan-3e parts (in sub-1000 piece quantities,
> not zillions) will be?  I'm hoping that the 3S500E in the
> chipscale BGA will be one of the first; I've been waiting for
> a high-density FPGA in a tiny package.  It's a shame that none
> of the Spartan-3 parts larger than the 3S50 are available in
> that package.
>
> Thanks,
> Eric


Hi Mr. Smith,

The 3S500E in the CP132 package will be sampling to the general customer
base by mid- to end-July 2005.

The reason that the higher density CP132 devices are Spartan-3E instead of
Spartan-3 is that Spartan-3E delivers more gates at a lower price in that
footprint.
---------------------------------
Steven K. Knapp
Applications Manager, Xilinx Inc.
General Products Division
Spartan-3/-3E FPGAs
http://www.xilinx.com/spartan3e
---------------------------------
The Spartan(tm)-3 Generation:  The World's Lowest-Cost FPGAs.

Hi Steven,

What prices can we expect in comparison to Spartan3?
Let's say a XC3S250E compared to a XC3S200 in the same package.
Will the CP132 package be priced next to the TQ144?
When XC3E250E components will be available?

Thanks,

Luiz Carlos

My answers are inserted below.

<oen_no_spam@yahoo.com.br> wrote in message
news:1119869955.246586.18810@f14g2000cwb.googlegroups.com...
> Hi Steven,
>
> What prices can we expect in comparison to Spartan3?
> What prices can we expect in comparison to Spartan3?

For low to medium pin count packages, Spartan-3E is priced at or below a
comparably sized Spartan-3 FPGA.  Spartan-3 is llower cost for high pin
count packages.

> Let's say a XC3S250E compared to a XC3S200 in the same package.

For 2006 delivery, the XC3S250E will be lower cost.

> Will the CP132 package be priced next to the TQ144?

The CP132 package is generally about the same price as the TQ144.

> When XC3E250E components will be available?

The XC3S250E FPGA starts sampling in the September 2005 time frame, after
the XC3S100E and XC3S500E FPGAs.

>
> Thanks,
>
> Luiz Carlos
---------------------------------
Steven K. Knapp
Applications Manager, Xilinx Inc.
General Products Division
Spartan-3/-3E FPGAs
http://www.xilinx.com/spartan3e
---------------------------------
The Spartan(tm)-3 Generation:  The World's Lowest-Cost FPGAs.

Hi Steven,

Thankyou for your answers.

I have another doubt:
At XILINX web site we have:
           TQ144   PQ208   FT256
XC3S200-4  $15.10  $20.25  $25.55
XC3S400-4  $22.00  $25.50  $27.00

I know these prices are for small quantities but, why the package has
so different impact for the two components?
69.2% from TQ144 to FT256 on XC3S200, and
22.7% from TQ144 to FT256 on XC3S400!
Note that both components use all available pins/balls in all mentioned
packages.

If we need a lot of pins, it looks like using two XC3S200-TQ144 is
better than using one XC3S200-FT256. Some more pins, double the logic,
more components = better discount! I know some facts are missing, but I
really never understood why this huge price difference.

Can we expect the same behavior for SPARTAN3E (XC3S250E to XC3S500E) ?

Luiz Carlos

Don't fade away before an answer!

If the 200 part die is pad limited then the die size(and therfore
cost?) is more closely related to the number of pads(IO) rather than
the amount of logic.

Maybe the 400 is not pad limited.

Who knows how Xilinx do their pricing, if its based on value to the
customer - maybe IO is more important to the customer than logic at
those logic densities.

If you are looking at small production volumes I would choose a single
part to minimise development cost. If larger volumes then I would have
thought this pricing is not so relevant anyway.