bga routing

Hi all,
as many of you may know after all my posts, I'm working with a Spartan3
in the FT256 BGA package. Could anyone give me a link or something on
documentation that may help me routing all those pins out in that kind
of package with a 4-6 layer board. I'd like to get some examples or
guidelines related to the most common approach adopted by experienced
people.
Thanks,
Marco

Hi Marco,
http://groups.google.com/groups?q=PCBs+for+modern+FPGAs
HTH,
Cheers, Syms.
"Marco" <marco@marylon.com> wrote in message 
news:1150451628.497499.313150@f6g2000cwb.googlegroups.com...
> Hi all,
> as many of you may know after all my posts, I'm working with a Spartan3
> in the FT256 BGA package. Could anyone give me a link or something on
> documentation that may help me routing all those pins out in that kind
> of package with a 4-6 layer board. I'd like to get some examples or
> guidelines related to the most common approach adopted by experienced
> people.
> Thanks,
> Marco
> 



Inviato da X-Privat.Org - Registrazione gratuita http://www.x-privat.org/join.php

Marco wrote:
> Hi all,
> as many of you may know after all my posts, I'm working with a Spartan3
> in the FT256 BGA package. Could anyone give me a link or something on
> documentation that may help me routing all those pins out in that kind
> of package with a 4-6 layer board. I'd like to get some examples or
> guidelines related to the most common approach adopted by experienced
> people.
> Thanks,
> Marco

I have been doing it last 6 years or so on 1.27 mm pitched BGAs
on two signal layers (top and bottom), planes as necessary (actually
6 in all cases so far), 3 lines between BGA pads, pitched 10 mils
(say, 5 mils trace and 5 mils gap, these may vary to 4-6 or 6-4).
Pad to gap is 5 or even 4 mil, drilling is 0.3mm or 0.2mm (I leave
this choice to the PCB house). I drill each BGA pad so I can have
access to all signals since my borads are typically expected
to begin to work and sell from revision 1; I have posted some
info before on how to avoid problems with the drilled BGA pads.

Dimiter

------------------------------------------------------
Dimiter Popoff               Transgalactic Instruments

http://www.tgi-sci.com
------------------------------------------------------

Marco,
try this
http://www.xilinx.com/bvdocs/appnotes/xapp157.pdf
Aurash


Marco wrote:

>Hi all,
>as many of you may know after all my posts, I'm working with a Spartan3
>in the FT256 BGA package. Could anyone give me a link or something on
>documentation that may help me routing all those pins out in that kind
>of package with a 4-6 layer board. I'd like to get some examples or
>guidelines related to the most common approach adopted by experienced
>people.
>Thanks,
>Marco
>
>  
>


-- 
 __
/ /\/\ Aurelian Lazarut
\ \  / System Verification Engineer
/ /  \ Xilinx Ireland
\_\/\/
 
phone:	353 01 4032639
fax:	353 01 4640324
    
     

>I have been doing it last 6 years or so on 1.27 mm pitched BGAs
>on two signal layers (top and bottom), planes as necessary (actually
>6 in all cases so far), 3 lines between BGA pads, pitched 10 mils
>(say, 5 mils trace and 5 mils gap, these may vary to 4-6 or 6-4).
>Pad to gap is 5 or even 4 mil, drilling is 0.3mm or 0.2mm (I leave
>this choice to the PCB house). I drill each BGA pad so I can have
>access to all signals since my borads are typically expected
>to begin to work and sell from revision 1; I have posted some
>info before on how to avoid problems with the drilled BGA pads.

I saw you'r doing radioactive measurement equipment. How do you handle the
fpga sensitivity to radiation ..?

pbdelete@spamnuke.ludd.luthdelete.se.invalid wrote:
> >I have been doing it last 6 years or so on 1.27 mm pitched BGAs
> >on two signal layers (top and bottom), planes as necessary (actually
> >6 in all cases so far), 3 lines between BGA pads, pitched 10 mils
> >(say, 5 mils trace and 5 mils gap, these may vary to 4-6 or 6-4).
> >Pad to gap is 5 or even 4 mil, drilling is 0.3mm or 0.2mm (I leave
> >this choice to the PCB house). I drill each BGA pad so I can have
> >access to all signals since my borads are typically expected
> >to begin to work and sell from revision 1; I have posted some
> >info before on how to avoid problems with the drilled BGA pads.
>
> I saw you'r doing radioactive measurement equipment. How do you handle the
> fpga sensitivity to radiation ..?

I don't. For two reasons - one, because the measuring equipment
does not experience any radiation of concern. Often the levels
measured are below the natural background, and the detector
is placed in a lead shield with 10+ cm walls... There are also
high count rate applications, but it is the detector which
sees the counts, not the analyzer (several meters cable).

Second, I only use CPLDs, not FPGAs, in my equipment.... :-) :-).
(I use Coolrunners).

Dimiter

------------------------------------------------------
Dimiter Popoff               Transgalactic Instruments

http://www.tgi-sci.com
------------------------------------------------------

pd,

Spartan 3 latest atmospheric neutron readout is 6.3 FIT/Mb.  It is still 
decreasing.

The LANSCE cross sections were less than half V2.

S3 is not recommended for heavy ion applications (space) as there is no 
mil version with epi wafer.

CERN uses our parts to instrument their beams.

Many labs use our parts.

Unless they are actually near the beam, there is no radiation issue.

If they are near the beam, total dode, and upsets, can be determined, 
and then mitigated by design.

I leave you with the following:  Xilinx FPGAs today allow the engineer 
to design to, and meet, any arbritrary MTB or FIT rate through the use 
of various techniques.  Doing this some other way is extremely painful, 
and can not be verified until you are completely finished (when it is 
too late).

For example, when you think you have a robust design, we have a tool 
which can go and change individual bits, one by one, or at random.  With 
beam time at more thanb $400 an hour, it is a lot cheaper to verify 
resiliance to upsets on your bench where you can find it, and then fix it.

Austin


pbdelete@spamnuke.ludd.luthdelete.se.invalid wrote:

>>I have been doing it last 6 years or so on 1.27 mm pitched BGAs
>>on two signal layers (top and bottom), planes as necessary (actually
>>6 in all cases so far), 3 lines between BGA pads, pitched 10 mils
>>(say, 5 mils trace and 5 mils gap, these may vary to 4-6 or 6-4).
>>Pad to gap is 5 or even 4 mil, drilling is 0.3mm or 0.2mm (I leave
>>this choice to the PCB house). I drill each BGA pad so I can have
>>access to all signals since my borads are typically expected
>>to begin to work and sell from revision 1; I have posted some
>>info before on how to avoid problems with the drilled BGA pads.
> 
> 
> I saw you'r doing radioactive measurement equipment. How do you handle the
> fpga sensitivity to radiation ..?
> 

>does not experience any radiation of concern. Often the levels
>measured are below the natural background, and the detector

Like measureing food activity I guess (or similar tasks).
(So you know when you die :)

>is placed in a lead shield with 10+ cm walls... There are also

No RoHS here then :)

>high count rate applications, but it is the detector which
>sees the counts, not the analyzer (several meters cable).

>Second, I only use CPLDs, not FPGAs, in my equipment.... :-) :-).
>(I use Coolrunners).

Yeah that pretty much solve it I guess. :-)
Wonder if actel fpga that uses eeprom cells for config would be at the same
radiation level as cpld..

Marco

How many layers you end up using depends a lot on the manufacturer that
you use for pcbs and their technology abilities, (principally track and
gap and via size etc), that you use. I would say using the FT256 that a
4 layer board is easily viable on the right technology level probably
4/5 thou (0.1-0.127mm) track and gap and maybe down to the easier 6
thou or 0.15mm track and gap. A 6 layer board will probably allow you
to use 8 thou or 0.2mm track and gap and allow a wider choice of
potential pcb manufacturers. How you do it wil vary a lot depending on
your pcb layout and what things connect to and where i.e. where things
are placed but to give you a practical example of what can be achieved
is our low cost Raggedstone1 product that achieves a full use of
XC3S400(264 I/O), in a FG456 package, on a 4 layer board. I will say
that wasn't easy even by our standards. The comparitive product of
Xilinx(Digilent) Spartan-3E Starter Kit board I believe has 8 layers to
do less than we do with I/O.

On a more general point Xilinx used to have breakout patterns for
things like Virtex2. Do have a search for those on their site. The is
also some useful info here
http://www.xilinx.com/bvdocs/userguides/ug072.pdf.

John Adair
Enterpoint Ltd.

Marco wrote:
> Hi all,
> as many of you may know after all my posts, I'm working with a Spartan3
> in the FT256 BGA package. Could anyone give me a link or something on
> documentation that may help me routing all those pins out in that kind
> of package with a 4-6 layer board. I'd like to get some examples or
> guidelines related to the most common approach adopted by experienced
> people.
> Thanks,
> Marco

On 16 Jun 2006 12:32:07 +0200, "Symon" <symon_brewer@hotmail.com> wrote:
>Hi Marco,
>http://groups.google.com/groups?q=PCBs+for+modern+FPGAs
>HTH,
>Cheers, Syms.

Also available at http://www.fpga-faq.org/archives/75000.html#75023

and the link http://www.fpga-faq.org/caf_pics/layer_1_2.gif

Cheers,
Philip