Reply by PFC May 20, 20082008-05-20
>> - PQ208 : put thermal pad below connected to GND, remove all GND >> pins >> from package ; put other smaller "thermal pads" for the power supplies >> and get rid of the supply pins, you get 50 more IO on the package. > > National did someting like that for the DP83847
Hey, this is a cool package, no pin wasting for power supplies, I like it... (plus it probably has better signal integrity). And no pins, which means no bent pins like on PQ208 !
> And keep 3.3V IO capability!
Well, definitely !
Reply by Uwe Bonnes May 20, 20082008-05-20
PFC <lists@peufeu.com> wrote:
> On Mon, 03 Mar 2008 20:40:07 +0100, Antti <Antti.Lukats@googlemail.com> > wrote:
> > here it is: > >
...
> Here's mine :
> - PQ208 : put thermal pad below connected to GND, remove all GND pins > from package ; put other smaller "thermal pads" for the power supplies > and get rid of the supply pins, you get 50 more IO on the package.
National did someting like that for the DP83847 ... And keep 3.3V IO capability! -- Uwe Bonnes bon@elektron.ikp.physik.tu-darmstadt.de Institut fuer Kernphysik Schlossgartenstrasse 9 64289 Darmstadt --------- Tel. 06151 162516 -------- Fax. 06151 164321 ----------
Reply by PFC May 20, 20082008-05-20
On Mon, 03 Mar 2008 20:40:07 +0100, Antti <Antti.Lukats@googlemail.com>  
wrote:

> here it is: > > 1) devices densities like in Spartan-3 (50..5000) > 2) devices packages like Spartan-3E (including QN132 !) or better > (microBGA 6x6 mm?) > 3) all good features of S3A/AN !! > 4) design security with OTP encryption key (like Lattice ECP2) > 5) other features as already planned by Xilinx
Here's mine : * Easy one : - Schmitt trigger on the TCK line * New packages to make prototyping easier and to make the chips easier to use on simpler boards that are less expensive, would translate into costs saving for small / simple systems, and possibly more sales from Xilinx ! Examples : - Self-centering BGA : put a through-hole pin in each of the corners of the BGA, the PCB designer makes 4 holes on the PCB, and the part now can be placed by a drunk intern, instead of a megabuck BGA placing robot. No, strike that, make it only 3 holes, so you can't put it the wrong way in. - PQ208 : put thermal pad below connected to GND, remove all GND pins from package ; put other smaller "thermal pads" for the power supplies and get rid of the supply pins, you get 50 more IO on the package. - BGA usable on a 4-layer board with standard specs (6/6 track and standard holes), instead of 6-layer with super small holes : Solution 1 : remove pins in a cross pattern for escaping with much less vias Solution 2 : Two exterior rows of pins @ 1mm pitch or even 0.8mm pitch, and all internal pins at 1.27mm pitch, to allow vias between the pins even on a cheap PCB process Interior pins : * A bit more difficult : - FPGAs shouldn't have input-only pins... the spartan-3E is a bit annoying for this... I know it's a compromise with the IOBs space on die, then a better solution would be a simpler IOB, supporting less features (like only LVCMOS output from the bank's voltage, not all the IOStandards) but please get rid of those input-only pins - If you can't get rid of the input-only pins, on the BGA package put them all in the internal balls close to the chip's center so if the designer doesn't need them he can forget them and save on layers... - more decoupling caps inside the package * Other : Hard SDRAM controller (or DDR) core in the chip and stacked SDRAM chip in the package, or multi chip module... you get the idea ;) ARM core Hey it was supposed to be a wishlist right ? In all of those if I just ge a more noise-tolerant TCK input I'll be happy.
Reply by Nico Coesel March 5, 20082008-03-05
rickman <gnuarm@gmail.com> wrote:

>On Mar 3, 5:08 pm, n...@puntnl.niks (Nico Coesel) wrote: >> "M.Randelzhofer" <techsel...@gmx.de> wrote: >> >"Antti" <Antti.Luk...@googlemail.com> schrieb im Newsbeitrag >> >news:467475ec-6d16-4789-acec-07d3c1a4977e@s19g2000prg.googlegroups.com... >> >> here it is: >> >> >> 1) devices densities like in Spartan-3 (50..5000) >> >> 2) devices packages like Spartan-3E (including QN132 !) or better >> >> (microBGA 6x6 mm?) >> >> 3) all good features of S3A/AN !! >> >> 4) design security with OTP encryption key (like Lattice ECP2) >> >> 5) other features as already planned by Xilinx >> >> >> Antti >> >> has made his Christmas wish this year... or did I just describe >> >> Lattice XP3 or Cyclone IV? >> >> eh, I just wish Spartan-4 will have all the good things from Spartan-3 >> >> subfamilies+extra goodies. >> >> >Hi Antti, >> >> >I've the same wishes, some additional i/O & memory cores would be nice: >> >> >6) USB2 host/slave interface with integrated PHY >> >> >7) Ethernet MAC + PHY >> >> >8) DDR2/3 core >> >> >9) some analog stuff (ADC, temp sensor, system supervisor) >> >> >S4 would be a serious competitor to 32bit microcontrollers, if some of their >> >standard peripherals are included in low price FPGA's. >> >> You forget a standard ARM core, some internal flash (say 32KB to >> 256KB), some memory (8KB to 64KB) and some standard pheripherals like >> UART, SPI, I2C. Such a device would be a real killer. I would design >> it in straight away if it existed today for a Spartan price. > >I thought you could get all that in an MCU? At that point do you even >need the FPGA anymore???
Well, the FPGA usually handles the fast stuff. In most devices which use an FPGA you'll find an MCU as well. So why not embed the MCU + flash +sram inside the FPGA. Sure there is Microblaze and Nios but they cost a lot of logic real-estate and have no internal flash. -- Programmeren in Almere? E-mail naar nico@nctdevpuntnl (punt=.)
Reply by Antti March 5, 20082008-03-05
On 5 Mrz., 13:39, rickman <gnu...@gmail.com> wrote:
> On Mar 5, 1:01 am, Antti <Antti.Luk...@googlemail.com> wrote: > > > > > On 5 Mrz., 05:45, rickman <gnu...@gmail.com> wrote: > > > > On Mar 3, 4:42 pm, Antti <Antti.Luk...@googlemail.com> wrote: > > > > > On 3 Mrz., 22:16, DJ Delorie <d...@delorie.com> wrote: > > > > > > Antti <Antti.Luk...@googlemail.com> writes: > > > > > > 2) devices packages like Spartan-3E (including QN132 !) or better > > > > > > (microBGA 6x6 mm?) > > > > > > I keep wondering if there's a market for a few "unbalanced" devices, > > > > > like something with a ton of gates but in a tqfp-64 package. Or BGA > > > > > packages that only use the two outer rows for signals, for simpler > > > > > board routing. > > > > > > Likewise, I'd like to see the occasional MCU with a ton of ram and a > > > > > little flash, rather than the other way as it usually is. Every once > > > > > in a while I need a smart buffer chip :-( > > > > > oh yes, TQFP48 0.5mm pitch FPGA running from single voltage! > > > > defenetly, but hey thats wish for new Lattice device ;) > > > > > BTW, Actel QFN132 3 row QFN 0.5mm pitch CAN be used on > > > > 2 layer PCB or even single layer. > > > > > Antti > > > > I have not looked very hard at the 132 pin QFN package. But at 0.5 mm > > > pin pitch, how exactly do you route signals from the middle row out? > > > I guess the pins are actually 1.5 mm pitch on each row for 0.5 mm > > > considering all three rows? One of the problems I have using 0.65 mm > > > pitch QFPs is that I can't route between the pins. That is a real > > > PITA. I sometimes think I would be better off with a wider pitch > > > part, but I'm not sure I can fit them on the board... :^( > > > its 0.5mm pitch. > > middle row pins can not be used on 2 layer PCB > > only outer and inner row. my application did not > > need much IO so that was sufficient > > I guess your first statement above that the part "CAN be used" on a 2 > layer board means, there is no power or essential control signals on > the middle row? So I guess it can be used if you don't mind losing a > huge percentage of the I/O?
right there think is 1 JTAG pin in middle row, this can route out via I/O similarly all VCC/IO in middle row can be routed as needed. Antti
Reply by rickman March 5, 20082008-03-05
On Mar 5, 1:01 am, Antti <Antti.Luk...@googlemail.com> wrote:
> On 5 Mrz., 05:45, rickman <gnu...@gmail.com> wrote: > > > > > On Mar 3, 4:42 pm, Antti <Antti.Luk...@googlemail.com> wrote: > > > > On 3 Mrz., 22:16, DJ Delorie <d...@delorie.com> wrote: > > > > > Antti <Antti.Luk...@googlemail.com> writes: > > > > > 2) devices packages like Spartan-3E (including QN132 !) or better > > > > > (microBGA 6x6 mm?) > > > > > I keep wondering if there's a market for a few "unbalanced" devices, > > > > like something with a ton of gates but in a tqfp-64 package. Or BGA > > > > packages that only use the two outer rows for signals, for simpler > > > > board routing. > > > > > Likewise, I'd like to see the occasional MCU with a ton of ram and a > > > > little flash, rather than the other way as it usually is. Every once > > > > in a while I need a smart buffer chip :-( > > > > oh yes, TQFP48 0.5mm pitch FPGA running from single voltage! > > > defenetly, but hey thats wish for new Lattice device ;) > > > > BTW, Actel QFN132 3 row QFN 0.5mm pitch CAN be used on > > > 2 layer PCB or even single layer. > > > > Antti > > > I have not looked very hard at the 132 pin QFN package. But at 0.5 mm > > pin pitch, how exactly do you route signals from the middle row out? > > I guess the pins are actually 1.5 mm pitch on each row for 0.5 mm > > considering all three rows? One of the problems I have using 0.65 mm > > pitch QFPs is that I can't route between the pins. That is a real > > PITA. I sometimes think I would be better off with a wider pitch > > part, but I'm not sure I can fit them on the board... :^( > > its 0.5mm pitch. > middle row pins can not be used on 2 layer PCB > only outer and inner row. my application did not > need much IO so that was sufficient
I guess your first statement above that the part "CAN be used" on a 2 layer board means, there is no power or essential control signals on the middle row? So I guess it can be used if you don't mind losing a huge percentage of the I/O?
Reply by Antti March 5, 20082008-03-05
On 5 Mrz., 05:45, rickman <gnu...@gmail.com> wrote:
> On Mar 3, 4:42 pm, Antti <Antti.Luk...@googlemail.com> wrote: > > > > > On 3 Mrz., 22:16, DJ Delorie <d...@delorie.com> wrote: > > > > Antti <Antti.Luk...@googlemail.com> writes: > > > > 2) devices packages like Spartan-3E (including QN132 !) or better > > > > (microBGA 6x6 mm?) > > > > I keep wondering if there's a market for a few "unbalanced" devices, > > > like something with a ton of gates but in a tqfp-64 package. Or BGA > > > packages that only use the two outer rows for signals, for simpler > > > board routing. > > > > Likewise, I'd like to see the occasional MCU with a ton of ram and a > > > little flash, rather than the other way as it usually is. Every once > > > in a while I need a smart buffer chip :-( > > > oh yes, TQFP48 0.5mm pitch FPGA running from single voltage! > > defenetly, but hey thats wish for new Lattice device ;) > > > BTW, Actel QFN132 3 row QFN 0.5mm pitch CAN be used on > > 2 layer PCB or even single layer. > > > Antti > > I have not looked very hard at the 132 pin QFN package. But at 0.5 mm > pin pitch, how exactly do you route signals from the middle row out? > I guess the pins are actually 1.5 mm pitch on each row for 0.5 mm > considering all three rows? One of the problems I have using 0.65 mm > pitch QFPs is that I can't route between the pins. That is a real > PITA. I sometimes think I would be better off with a wider pitch > part, but I'm not sure I can fit them on the board... :^(
its 0.5mm pitch. middle row pins can not be used on 2 layer PCB only outer and inner row. my application did not need much IO so that was sufficient Antti
Reply by rickman March 5, 20082008-03-05
On Mar 4, 11:22 am, Antti <Antti.Luk...@googlemail.com> wrote:
> On 3 Mrz., 23:08, n...@puntnl.niks (Nico Coesel) wrote: > > > > > "M.Randelzhofer" <techsel...@gmx.de> wrote: > > >"Antti" <Antti.Luk...@googlemail.com> schrieb im Newsbeitrag > > >news:467475ec-6d16-4789-acec-07d3c1a4977e@s19g2000prg.googlegroups.com... > > >> here it is: > > > >> 1) devices densities like in Spartan-3 (50..5000) > > >> 2) devices packages like Spartan-3E (including QN132 !) or better > > >> (microBGA 6x6 mm?) > > >> 3) all good features of S3A/AN !! > > >> 4) design security with OTP encryption key (like Lattice ECP2) > > >> 5) other features as already planned by Xilinx > > > >> Antti > > >> has made his Christmas wish this year... or did I just describe > > >> Lattice XP3 or Cyclone IV? > > >> eh, I just wish Spartan-4 will have all the good things from Spartan-3 > > >> subfamilies+extra goodies. > > > >Hi Antti, > > > >I've the same wishes, some additional i/O & memory cores would be nice: > > > >6) USB2 host/slave interface with integrated PHY > > > >7) Ethernet MAC + PHY > > > >8) DDR2/3 core > > > >9) some analog stuff (ADC, temp sensor, system supervisor) > > > >S4 would be a serious competitor to 32bit microcontrollers, if some of their > > >standard peripherals are included in low price FPGA's. > > > You forget a standard ARM core, some internal flash (say 32KB to > > 256KB), some memory (8KB to 64KB) and some standard pheripherals like > > UART, SPI, I2C. Such a device would be a real killer. I would design > > it in straight away if it existed today for a Spartan price. > > > -- > > Programmeren in Almere? > > E-mail naar nico@nctdevpuntnl (punt=.) > > well, Xilinx already own ARM IP-Core license, when Xilinx purchased > Triscend > they also got the IP licenses ownded by Triscend what included also > ARM. > > so it is possible that the ARM core see new life in Spartan-4, > Xilinx has no extra royalty to pay
Yes, anything is possible. I might even win the Powerball... no, I don't buy tickets... So far, Xilinx has given no indication that they bought Triscend for any reason other than to keep ARM out of the FPGA market. Just like so many other companies that Xilinx bought and deleted, the purpose seems to have been to bury the technology rather than to develop it. Xilinx seems to have a strong opinion that CPU hard cores do not mesh well with FPGAs as it creates too many combinations of RAM, FPGA size and package so that the number of parts blooms to unmanageable numbers. But then Xilinx has a history of making a firm stand on a point and later reversing themselves when *they* think conditions are different. Meanwhile other companies eat their lunch for a bit while they are still making their stand. Embedded memory is one example. Xilinx was one of the last companies to add that to the FPGA. Later the integrated hard logic block was another reversal. I wonder if their line in the sand against Flash FPGAs will be another soon to happen reversal. When the focus on getting the most logic on a die for the lowest price was the main FPGA goal, the anti-Flash opinion sounded good. But I think the density is high enough now that there are tons of applications that will benefit from having the Flash integrated on the die even if there is a die size penalty due to the lagging process technology. Rather like the way that Intel and AMD can't figure out what to do with all the transistors on a die, so they are adding more and more copies of the CPUs, at some point FPGAs will have more than enough LUTs for most apps and other features will become the main selection criteria. It may not be the Spartan iv, but sometime soon, there will be a combo chip with a right sized FPGA, various peripherals (ones that make sense as a hard core rather than a soft one) and on die Flash memory, both as configuration and program storage for an integrated CPU. Isn't it ST Micro that has the Spear which is an ARM with bells and whistles including a metal programmable gate array? That is just one step away from having an on die FPGA... I would be willing to bet the only thing that stopped them from using an FPGA instead of a metal programmed part was patents... you know, the ones that Triscend had and now are buried in the vaults at Xilinx. I can see a guy pushing a dolly into an endless warehouse as the camera pulls back to show the mountains of buried IP... Maybe Xilinx was concerned that ARM might prove them wrong?!!
Reply by March 5, 20082008-03-05
rickman <gnuarm@gmail.com> writes:
> Hey, I'd be happy with pretty much *any* FPGA in a small leaded > package, even a 100 pin TQFP.
There are plenty of Spartans in QFP packages, as well as other vendors... http://www.digikey.com/scripts/DkSearch/dksus.dll?Cat=2556262;keywords=fpga%20qfp;stock=1
> I think there is an Atmel ARM part which has a huge amount of RAM > although I want to say the flash is external, but it might be a dual > die approach with both in the same package. It is one of their > older parts and I expect it will only run at 33 MHz.
The MCUs I'm working with are 20MHz, 24k flash and 2k ram. I think it would be interesting to see one with 2k flash and 24k ram, for example.
Reply by rickman March 5, 20082008-03-05
On Mar 3, 5:08 pm, n...@puntnl.niks (Nico Coesel) wrote:
> "M.Randelzhofer" <techsel...@gmx.de> wrote: > >"Antti" <Antti.Luk...@googlemail.com> schrieb im Newsbeitrag > >news:467475ec-6d16-4789-acec-07d3c1a4977e@s19g2000prg.googlegroups.com... > >> here it is: > > >> 1) devices densities like in Spartan-3 (50..5000) > >> 2) devices packages like Spartan-3E (including QN132 !) or better > >> (microBGA 6x6 mm?) > >> 3) all good features of S3A/AN !! > >> 4) design security with OTP encryption key (like Lattice ECP2) > >> 5) other features as already planned by Xilinx > > >> Antti > >> has made his Christmas wish this year... or did I just describe > >> Lattice XP3 or Cyclone IV? > >> eh, I just wish Spartan-4 will have all the good things from Spartan-3 > >> subfamilies+extra goodies. > > >Hi Antti, > > >I've the same wishes, some additional i/O & memory cores would be nice: > > >6) USB2 host/slave interface with integrated PHY > > >7) Ethernet MAC + PHY > > >8) DDR2/3 core > > >9) some analog stuff (ADC, temp sensor, system supervisor) > > >S4 would be a serious competitor to 32bit microcontrollers, if some of their > >standard peripherals are included in low price FPGA's. > > You forget a standard ARM core, some internal flash (say 32KB to > 256KB), some memory (8KB to 64KB) and some standard pheripherals like > UART, SPI, I2C. Such a device would be a real killer. I would design > it in straight away if it existed today for a Spartan price.
I thought you could get all that in an MCU? At that point do you even need the FPGA anymore??? After I had presented to the customer my approach using an FPGA do handle the data path for a simple board which had some standard and non standard interfaces, I found out about an ADI part which is a DSP combined with a high resolution Codec. I didn't look at it really hard, but at first glance, it looks like it could have been as good of a solution and a bit cheaper than the FPGA + codec. I will say I prefer writing VHDL to coding DSPs though. The toolsets tend to be cheaper too. But I have to say the DSP approach looks pretty good.